The major manufacturers of smartphones are moving towards eight processor cores. Following the same road, Huawei has announced a new SoC, dubbed as Hisilicon K3V3 and K3V2 successor, a chip that will feature eight cores based on Cortex architecture -A15, unlike what we saw in the Samsung SoC big.LITTLE consists of two modules, one with 4 cores A15 and one with four cores A7. And this chip would be used in Huawei Ascend P7. This phone would be successor to the recent released world’s thinnest smartphone Huawei Ascend P6.
Among its main features is its ability to automatically adjust their frequencies by battery level, a function that also come into play if the processor reaches too high temperatures then again it will reduce its frequcny. Regarding maximum working frequencies are talking about 1.8 GHz per core, while the manufacturing process used is 28nm. Along with this configuration, Huawei will use 3GB RAM in Huawei Ascend P6 K3V3 Hisilicon powered smartphone.
Other specs regarding this phone includes, 4.7 inches full HD LCD display, 2700 mAh battery, 4G capabilities and other things has not been revealed. Sources reveal that, Huawei will surprise the world with this Huawei Ascend P6 Hisilicon K3V3 8-core processor powered smartphone at Christmas, stay tuned for more information, happy toipoing.